A research team from the Korea Institute of Materials Science (KIMS), led by Dr. Hyun-Ae Cha, has developed a groundbreaking composite material designed for heat dissipation. This innovative material, created using a unique protein foaming process inspired by egg whites, offers both eco-friendliness and cost-effective manufacturing. The findings were published on May 28, 2023, in the journal Advanced Science, where it was featured as the cover article for Volume 12, Issue 33.
The new composite material utilizes a three-dimensional structure of magnesium oxide (MgO) that enables efficient thermal pathways for rapid heat transfer. This advancement results in a thermal conductivity that is up to 2.6 times higher than conventional heat-dissipating composites. As electronic devices become more powerful and compact, effective thermal management has become crucial, particularly in electric vehicles (EVs), where inadequate cooling can lead to performance issues or even safety hazards like fires.
Current thermal interface materials (TIMs) typically involve mixing thermally conductive fillers into a polymer matrix. This method often results in a random distribution of fillers, which can disrupt thermal pathways and limit performance. Increasing the filler amount may enhance thermal conductivity, but it complicates processing and raises costs.
In response to these challenges, the KIMS team employed a protein foaming method that creates a dense, interconnected network of particles. By leveraging the properties of egg-white proteins that expand at high temperatures, they successfully formed a composite material with continuous thermal pathways. This design prevents interruptions in heat transfer and allows for a significant increase in thermal conductivity, reaching 17.19 W/m·K.
One of the remarkable aspects of this new material is its use of lightweight and low-cost magnesium oxide. The composite outperforms traditional materials, such as aluminum oxide (Al2O3) and nitride-based heat-dissipating substances, in thermal conductivity. Furthermore, by integrating the composite with epoxy resin, a polymer commonly used for thermal fillers, the team has fabricated a material suitable for practical applications.
The implications of this technology are significant. It is expected to improve the performance and reliability of various high-heat-generating devices, including electronic equipment, semiconductor packages, EV batteries, 5G communication devices, and high-performance servers. In Korea, the domestic market for thermal interface materials is estimated to exceed KRW 200 billion annually, yet it remains heavily reliant on imports. The commercialization of this innovative technology could greatly enhance Korea’s self-reliance in thermal management materials.
Dr. Hyun-Ae Cha remarked on the project’s significance, stating, “Through the protein foaming–based process, we can produce high–thermal–conductivity materials in an eco-friendly and cost-effective way.” She emphasized that this research exemplifies the potential for developing lightweight, high-performance heat-dissipating materials.
The research was supported by the Nano Materials Technology Development Program of the National Research Foundation of Korea (NRF). As the demand for effective thermal management solutions grows, this development represents a promising step towards achieving more sustainable and efficient technologies in various industries.
